The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8211500 B1

PDF
Full Text
Expired
Date of Patent:
Jul. 03, 2012

Filed:

Feb. 25, 2005
Applicants:

Yasuhiko Kojima, Tokyo-To, JP;

Naoki Yoshii, Tokyo-To, JP;

Inventors:

Yasuhiko Kojima, Tokyo-To, JP;

Naoki Yoshii, Tokyo-To, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 16/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A Cu film is deposited on a substrate by ALD (Atomic Layer Deposition) process, in which: a Cu-carboxyl acid complex or a derivative thereof having a high vapor pressure and wettability to a base is used in a gasified state; His used as a reductive gas; and a step of adsorbing a source material gas to a substrate and a step of forming a Cu film by reducing the adsorbed gas with a reductive gas are repeated alternately. With this method, a conformal Cu film having excellent quality can be formed.


Find Patent Forward Citations

Kojima, Yasuhiko. (2012). Copper film deposition method (U.S. Patent No. 8211500). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8211500

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