The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 03, 2012

Filed:

Sep. 22, 2006
Applicants:

Deepak Mahulikar, Madison, CT (US);

Yuhu Wang, Santa Rosa, CA (US);

Ken A. Delbridge, Chandler, AZ (US);

Gert R. M. Moyaerts, Phoenix, AZ (US);

Saeed H. Mohseni, Sylvania, OH (US);

Nichole R. Koontz, Mesa, AZ (US);

Bin HU, Chandler, AZ (US);

Liqing Wen, Mesa, AZ (US);

Inventors:

Deepak Mahulikar, Madison, CT (US);

Yuhu Wang, Santa Rosa, CA (US);

Ken A. Delbridge, Chandler, AZ (US);

Gert R. M. Moyaerts, Phoenix, AZ (US);

Saeed H. Mohseni, Sylvania, OH (US);

Nichole R. Koontz, Mesa, AZ (US);

Bin Hu, Chandler, AZ (US);

Liqing Wen, Mesa, AZ (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24D 3/02 (2006.01); C09C 1/68 (2006.01); C09K 3/14 (2006.01); C09K 13/00 (2006.01); C09K 13/02 (2006.01); B24B 1/00 (2006.01); C01B 33/12 (2006.01); C03C 15/00 (2006.01); C03C 25/68 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of chemical mechanical polishing a surface of a substrate including the step of: contacting the substrate and a composition including a plurality of colloidal silica particles having less than 200 ppb of each trace metal impurity, excluding potassium and sodium, have less than 2 ppm residual alcohol and wherein the cumulative concentration of the trace metal, excluding potassium and sodium, is in the range from about 0.5 to about 5 ppm; and a medium for suspending the particles; wherein the composition is an ultrapure colloidal silica dispersion; and wherein the contacting is carried out at a temperature and for a period of time sufficient to planarize the substrate.


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