The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 26, 2012

Filed:

Mar. 04, 2011
Applicants:

Tomohiro Funakoshi, Hitachinaka, JP;

Junko Konishi, Yokohama, JP;

Yuko Kariya, Hitachinaka, JP;

Noritsugu Takahashi, Kokubunji, JP;

Fumiaki Endo, Hitachinaka, JP;

Inventors:

Tomohiro Funakoshi, Hitachinaka, JP;

Junko Konishi, Yokohama, JP;

Yuko Kariya, Hitachinaka, JP;

Noritsugu Takahashi, Kokubunji, JP;

Fumiaki Endo, Hitachinaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 7/18 (2006.01);
U.S. Cl.
CPC ...
Abstract

A defect detected by a wafer inspection tool is reliably captured by a defect review tool. A defect review condition in the defect review tool is varied depending on defect attributes provided by the wafer inspection tool so as to optimize the review process. For example, review magnification is varied depending on the size of the defect, or the frame addition number is varied depending on the maximum gray level difference.


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