The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 15, 2012
Filed:
Nov. 23, 2009
Wen-wei Shen, Xinzhuang, TW;
Chen-shien Chen, Hsinchu County, TW;
Chen-cheng Kuo, Chu-Pei, TW;
Chih-hua Chen, Jhubei, TW;
Ching-wen Hsiao, Banqiao, TW;
Wen-Wei Shen, Xinzhuang, TW;
Chen-Shien Chen, Hsinchu County, TW;
Chen-Cheng Kuo, Chu-Pei, TW;
Chih-Hua Chen, Jhubei, TW;
Ching-Wen Hsiao, Banqiao, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
A flip-chip packaging assembly and integrated circuit device are disclosed. An exemplary flip-chip packaging assembly includes a first substrate; a second substrate; and joint structures disposed between the first substrate and the second substrate. Each joint structure comprises an interconnect post between the first substrate and the second substrate and a joint solder between the interconnect post and the second substrate, wherein the interconnect post exhibits a width and a first height. A pitch defines a distance between each joint structure. The first height is less than half the pitch.