The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 17, 2012

Filed:

Apr. 17, 2007
Applicants:

Martin Dauelsberg, Aachen, DE;

Johannes Käppeler, Würselen, DE;

Bernd Schulte, Aachen, DE;

Inventors:

Martin Dauelsberg, Aachen, DE;

Johannes Käppeler, Würselen, DE;

Bernd Schulte, Aachen, DE;

Assignee:

Aixtron Inc., Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D 3/06 (2006.01); H01L 21/44 (2006.01); C23F 1/00 (2006.01); C23C 16/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

The invention relates to an apparatus for the deposition of one or more layers on a substrate (), which comprises a process chamber () which is arranged in a reactor housing () and has a heatable bottom () on which the substrate rests and a lid () extending parallel to the bottom () and also a gas inlet facility () for introduction of process gases. The distance (H) between the process chamber lid () and the process chamber bottom () can be reduced to virtually zero. A cooling apparatus () by means of which the process chamber lid () is cooled in the process position during deposition of the layers is provided above the process chamber lid (), with the distance between the cooling apparatus () and the process chamber lid () increasing as the distance (H) between the process chamber lid () and the process chamber bottom () is reduced.


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