The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 17, 2012
Filed:
Aug. 18, 2009
Clemens Zapilko, Burghausen, DE;
Thomas Jaeschke, Burgkirchen, DE;
Makoto Tabata, Burghausen, DE;
Klaus Roettger, Bachmehring, DE;
Clemens Zapilko, Burghausen, DE;
Thomas Jaeschke, Burgkirchen, DE;
Makoto Tabata, Burghausen, DE;
Klaus Roettger, Bachmehring, DE;
Siltronic AG, Munich, DE;
Abstract
Semiconductor wafers are CMP polished by polishing the rear side of the semiconductor wafer by means of CMP with a material removal with a profile along the diameter of the wafer wherein material removal is higher at the center than at the edge of the rear side; and polishing the front side of the wafer by means of CMP with a material removal with a profile along the diameter of the wafer wherein material removal is lower in the center of the front side than in an edge region of the front side.