The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 03, 2012
Filed:
Oct. 20, 2008
Tetsuya Ishikawa, Saratoga, CA (US);
Rick J. Roberts, San Jose, CA (US);
Helen R. Armer, Cupertino, CA (US);
Leon Volfovski, Mountain View, CA (US);
Jay D. Pinson, San Jose, CA (US);
Michael Rice, Pleasanton, CA (US);
David H. Quach, San Jose, CA (US);
Mohsen S. Salek, Saratoga, CA (US);
Robert Lowrance, Los Gatos, CA (US);
John A. Backer, San Jose, CA (US);
William Tyler Weaver, Austin, TX (US);
Charles Carlson, Cedar Park, TX (US);
Chongyang Wang, San Jose, CA (US);
Jeffrey Hudgens, San Francisco, CA (US);
Harald Herchen, Los Altos, CA (US);
Brian LU, Mountain View, CA (US);
Tetsuya Ishikawa, Saratoga, CA (US);
Rick J. Roberts, San Jose, CA (US);
Helen R. Armer, Cupertino, CA (US);
Leon Volfovski, Mountain View, CA (US);
Jay D. Pinson, San Jose, CA (US);
Michael Rice, Pleasanton, CA (US);
David H. Quach, San Jose, CA (US);
Mohsen S. Salek, Saratoga, CA (US);
Robert Lowrance, Los Gatos, CA (US);
John A. Backer, San Jose, CA (US);
William Tyler Weaver, Austin, TX (US);
Charles Carlson, Cedar Park, TX (US);
Chongyang Wang, San Jose, CA (US);
Jeffrey Hudgens, San Francisco, CA (US);
Harald Herchen, Los Altos, CA (US);
Brian Lu, Mountain View, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more repeatable wafer history, and also the cluster tool has a smaller system footprint. Embodiments also provide for a method and apparatus that are used to improve the coater chamber, the developer chamber, the post exposure bake chamber, the chill chamber, and the bake chamber process results. Embodiments also provide for a method and apparatus that are used to increase the reliability of the substrate transfer process to reduce system down time.