The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 27, 2012
Filed:
May. 17, 2006
Yasuo Kaneda, Tokyo, JP;
Munetoshi Irisawa, Tokyo, JP;
Yuji Toyoda, Tokyo, JP;
Toyokazu Komuro, Tokyo, JP;
Katsuya Fukase, Nagano, JP;
Toyoaki Sakai, Nagano, JP;
Yasuo Kaneda, Tokyo, JP;
Munetoshi Irisawa, Tokyo, JP;
Yuji Toyoda, Tokyo, JP;
Toyokazu Komuro, Tokyo, JP;
Katsuya Fukase, Nagano, JP;
Toyoaki Sakai, Nagano, JP;
Mitsubishi Paper Mills Limited, Tokyo, JP;
Shinko Electric Industries Co., Ltd., Nagano-shi, JP;
Abstract
There are provided a method for forming a resist pattern for preparing a circuit board having a landless or small-land-width through-hole(s) to realize a high-density circuit board, a method for producing a circuit board, and a circuit board. A method for forming a resist pattern, comprising the steps of forming a resin layer and a mask layer on a first surface of a substrate having a through-hole(s), and removing the resin layer on the through-hole(s) and on a periphery of the through-hole(s) on the first surface by supplying a resin layer removing solution from a second surface opposite to the first surface of the substrate, and a method for producing a circuit board using the method for forming a resist pattern, and a circuit board.