The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 20, 2012

Filed:

Mar. 17, 2010
Applicants:

Yi Sha Ku, Hsinchu, TW;

Wei Te Hsu, Banqiao, TW;

Hsiu Lan Pang, Baoshan Township, Hsinchu County, TW;

Deh Ming Shyu, Jhunan Township, Miaoli County, TW;

Inventors:

Yi Sha Ku, Hsinchu, TW;

Wei Te Hsu, Banqiao, TW;

Hsiu Lan Pang, Baoshan Township, Hsinchu County, TW;

Deh Ming Shyu, Jhunan Township, Miaoli County, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01B 11/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A system for via structure measurement is disclosed. The system comprises a reflectometer, a simulation unit and a comparing unit. The reflectometer is configured to collect a measured diffraction spectrum of at least a via. The simulation unit is configured to provide simulated diffraction spectrums of the at least a via. The comparing unit is configured to determine at least a depth and at least a bottom profile of the at least a via by comparing the collected diffraction spectrum and the simulated diffraction spectrums.


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