The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 13, 2012

Filed:

Sep. 24, 2008
Applicants:

Jack Chen, Fremont, CA (US);

Andrew D. Bailey, Iii, Pleasanton, CA (US);

Ben Mooring, Austin, TX (US);

Stephen J Cain, Travis, TX (US);

Inventors:

Jack Chen, Fremont, CA (US);

Andrew D. Bailey, III, Pleasanton, CA (US);

Ben Mooring, Austin, TX (US);

Stephen J Cain, Travis, TX (US);

Assignee:

Lam Research Corporation, Fremont, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); G06F 19/00 (2006.01); G05B 19/418 (2006.01); G05B 15/00 (2006.01); B44C 1/22 (2006.01); G06K 9/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for aligning a substrate to a process center of a support mechanism is provided. The method includes determining substrate thickness after substrate processing at a plurality of orientations and at a plurality of radial distances from a geometric center of the substrate. The method also includes deriving a set of process rate values from substrate thickness and process duration. The method further includes creating for a process rate an off-centered plot, which represents a substantially concentric circle whose points are a circumference of the off-centered plot having substantially the first process rate. The method yet also includes applying a curve-fitting equation to the off-centered plot to determine a set of parameters. The method yet further includes teaching a set of robot arms the set of parameters, thereby enabling the set of robot arms to align another substrate that is supported by the support mechanism with the process center.


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