The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 14, 2012
Filed:
May. 13, 2011
Nan-hsin Tseng, Tainan, TW;
Yun-han Lee, Baoshan Township, TW;
Chin-chou Liu, Jhubei, TW;
Ji-jan Chen, Hsin-Chu, TW;
Wei-pin Changchien, Taichung, TW;
Chien-hui Chen, Jhu-Dong Township, TW;
Nan-Hsin Tseng, Tainan, TW;
Yun-Han Lee, Baoshan Township, TW;
Chin-Chou Liu, Jhubei, TW;
Ji-Jan Chen, Hsin-Chu, TW;
Wei-Pin Changchien, Taichung, TW;
Chien-Hui Chen, Jhu-Dong Township, TW;
Taiwan Semiconductor Manufacturing Company, Ltd, Hsin-Chu, TW;
Abstract
A method includes electrically grounding a first plurality of metal bumps on a first surface of an interconnection component to a common ground plate. A voltage contrast (VC) image of a second plurality of metal bumps of the interconnection component is generated. Grey levels of the second plurality of metal bumps in the VC image are analyzed to find defect connections between the second plurality of metal bumps and respective ones of the first plurality of metal bumps.