The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 17, 2012
Filed:
Oct. 28, 2008
Ming-hong Tseng, Toufen Township, TW;
Kai-ming Ching, Jhudong Township, TW;
Chen-shien Chen, Zhubei, TW;
Ching-wen Hsiao, Banqiao, TW;
Hon-lin Huang, Hsin-Chu, TW;
Tsung-ding Wang, Tainan, TW;
Ming-Hong Tseng, Toufen Township, TW;
Kai-Ming Ching, Jhudong Township, TW;
Chen-Shien Chen, Zhubei, TW;
Ching-Wen Hsiao, Banqiao, TW;
Hon-Lin Huang, Hsin-Chu, TW;
Tsung-Ding Wang, Tainan, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
A system, a structure and a method of manufacturing stacked semiconductor substrates is presented. A first substrate includes a first side and a second side. A through substrate via (TSV) protrudes from the first side of the first substrate. A first protruding portion of the TSV has a conductive protective coating and a second protruding portion of the TSV has an isolation liner. The system further includes a second substrate and a joint interface structure that bonds the second substrate to the first substrate at the conductive protective coating of the first protruding portion of the TSV.