The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 27, 2011
Filed:
May. 24, 2011
Jonathan D. Chapple-sokol, Essex Junction, VT (US);
Daniel A. Delibac, Colchester, VT (US);
Zhong-xiang He, Essex Junction, VT (US);
Tom C. Lee, Essex Junction, VT (US);
William J. Murphy, North Ferrisburgh, VT (US);
Timothy D. Sullivan, Underhill, VT (US);
David C. Thomas, Richmond, VT (US);
Daniel S. Vanslette, Fairfax, VT (US);
Jonathan D. Chapple-Sokol, Essex Junction, VT (US);
Daniel A. Delibac, Colchester, VT (US);
Zhong-Xiang He, Essex Junction, VT (US);
Tom C. Lee, Essex Junction, VT (US);
William J. Murphy, North Ferrisburgh, VT (US);
Timothy D. Sullivan, Underhill, VT (US);
David C. Thomas, Richmond, VT (US);
Daniel S. Vanslette, Fairfax, VT (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A vertical metallic stack, from bottom to top, of an elemental metal liner, a metal nitride liner, a Ti liner, an aluminum portion, and a metal nitride cap, is formed on an underlying metal interconnect structure. The vertical metallic stack is annealed at an elevated temperature to induce formation of a TiAlliner by reaction of the Ti liner with the material of the aluminum portion. The material of the TiAlliner is resistant to electromigration, thereby providing enhanced electromigration resistance to the vertical metallic stack comprising the elemental metal liner, the metal nitride liner, the TiAlliner, the aluminum portion, and the metal nitride cap. The effect of enhanced electromigration resistance may be more prominent in areas in which the metal nitride cap suffers from erosion during processing.