The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 22, 2011
Filed:
Dec. 03, 2008
Kazutaka Koshiishi, Tokyo, JP;
Mitsuaki Katagiri, Tokyo, JP;
Satoshi Isa, Tokyo, JP;
Dai Sasaki, Tokyo, JP;
Kazutaka Koshiishi, Tokyo, JP;
Mitsuaki Katagiri, Tokyo, JP;
Satoshi Isa, Tokyo, JP;
Dai Sasaki, Tokyo, JP;
Elpida Memory, Inc., Tokyo, JP;
Abstract
A semiconductor device includes a substrate having bumps on the backside thereof, a first semiconductor chip mounted on the surface of the substrate, a second semiconductor chip mounted on the first semiconductor chip above the surface of the substrate, a first bonding wire having a length Lfor connecting the first semiconductor chip to the substrate, a second bonding wire having a length L(where L>L) for connecting the second semiconductor chip to the substrate, a first resin seal having a dielectric constant ∈for sealing the first bonding wire, and a second resin seal having a dielectric constant ∈(where ∈<∈) for sealing the second bonding wire. The relationship between the lengths Land Land the dielectric constants ∈and ∈is defined by an equation of ∈=∈(L/L).