The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 22, 2011
Filed:
Jun. 02, 2006
Un Gyu Paik, Seoul, KR;
Jea Gun Park, Seongnam-Si, KR;
Sang Kyun Kim, Busan, KR;
YE Hwan Kim, Seoul, KR;
Myoung Won Suh, Yongin-Si, KR;
Dae Hyeong Kim, Seoul, KR;
Un Gyu Paik, Seoul, KR;
Jea Gun Park, Seongnam-Si, KR;
Sang Kyun Kim, Busan, KR;
Ye Hwan Kim, Seoul, KR;
Myoung Won Suh, Yongin-Si, KR;
Dae Hyeong Kim, Seoul, KR;
K.C. Tech Co., Ltd., Gyeonggi-Do, KR;
IUCF-HYU, Seoul, KR;
Abstract
A CMP slurry is provided comprising polishing particles, the polishing particle comprising organically modified colloidal silica. Also, a method of preparing a CMP slurry is provided, comprising the steps of: preparing polishing particles comprising organically modified silica; converting the polishing particles into an aqueous state; and adding pure water, a hydrophilic additive and a dispersing agent to the polishing particles. The polishing particles can be synthesized using a sol-gel process. According to the invention, a slurry having excellent polishing properties can be prepared, in which the surface properties of colloidal silica are changed to control the physical properties of the polishing particles and which can ensure a desired CMP removal rate while minimizing the occurrence of scratches.