The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 2011
Filed:
Oct. 17, 2007
Tamami Takahashi, Tokyo, JP;
Kenya Ito, Tokyo, JP;
Mitsuhiko Shirakashi, Tokyo, JP;
Kazuyuki Inoue, Tokyo, JP;
Kenji Yamaguchi, Tokyo, JP;
Masaya Seki, Tokyo, JP;
Satoru Sato, Akishima, JP;
Jun Watanabe, Akishima, JP;
Kenji Kato, Akishima, JP;
Jun Tamura, Akishima, JP;
Souichi Asakawa, Akishima, JP;
Tamami Takahashi, Tokyo, JP;
Kenya Ito, Tokyo, JP;
Mitsuhiko Shirakashi, Tokyo, JP;
Kazuyuki Inoue, Tokyo, JP;
Kenji Yamaguchi, Tokyo, JP;
Masaya Seki, Tokyo, JP;
Satoru Sato, Akishima, JP;
Jun Watanabe, Akishima, JP;
Kenji Kato, Akishima, JP;
Jun Tamura, Akishima, JP;
Souichi Asakawa, Akishima, JP;
EBARA Corporation, Tokyo, JP;
NIHON Micro Coating Co., Ltd., Tokyo, JP;
Abstract
A device for polishing the peripheral edge part of a semiconductor wafer includes a wafer stage for holding the wafer, a wafer stage unit including devices for rotating the wafer stage, causing the wafer stage to undergo a rotary reciprocating motion within the same plane as the surface of the wafer stage, and moving the wafer stage parallel to the surface, a notch polishing part for polishing the notch on the wafer and a bevel polishing part for polishing the beveled part of the wafer. Pure water is supplied to the wafer to prevent it from becoming dry as it is transported from the notch polishing part to the bevel polishing part.