The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8003587 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 23, 2011

Filed:

Mar. 13, 2009
Applicants:

Wai Mun Lee, Fremont, CA (US);

Cass X Shang, Sunnyvale, CA (US);

Atsushi Otake, Kawasaki, JP;

Akira Kuroda, Kanagawa, JP;

Takanori Matsumoto, Kawasaki, JP;

Hisashi Takeda, Tokyo, JP;

Inventors:

Wai Mun Lee, Fremont, CA (US);

Cass X Shang, Sunnyvale, CA (US);

Atsushi Otake, Kawasaki, JP;

Akira Kuroda, Kanagawa, JP;

Takanori Matsumoto, Kawasaki, JP;

Hisashi Takeda, Tokyo, JP;

Assignee:

EKC Technology, Inc., Hayward, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C11D 7/50 (2006.01);
U.S. Cl.
CPC ...
Abstract

A composition that includes 2-(2-aminoethylamino)-ethanol, at least one of a chelating agent and a corrosion inhibitor, and water. The composition is capable of removing organic, organometallic and metal oxide residues from semiconductor substrates. The invention also relates to a method of removing etching residue from a semiconductor substrate.


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Lee, Wai. (2011). Semiconductor process residue removal composition and process (U.S. Patent No. 8003587). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8003587

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