The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 09, 2011
Filed:
Mar. 20, 2006
Masato Hayashi, Kobe, JP;
Masami Yakabe, Tokyo, JP;
Tetsuya Hasebe, Tokyo, JP;
Muneo Harada, Nishinomiya, JP;
Katsuya Okumura, Tokyo, JP;
Masato Hayashi, Kobe, JP;
Masami Yakabe, Tokyo, JP;
Tetsuya Hasebe, Tokyo, JP;
Muneo Harada, Nishinomiya, JP;
Katsuya Okumura, Tokyo, JP;
Tokyo Electron Limited, Tokyo, JP;
Octec Inc., Tokyo, JP;
Abstract
A first wiring layeris disposed on an insulating filmon the lower surface of an upper substrate, while a second wiring layerthree-dimensionally crossing the first wiring layeris provided on the insulating filmon a lower substrate. A cantileverhas one end connected to the first wiring layerand the other end opposed to the second wiring layerwith a space therebetween. A thermoplastic sheetis arranged on the upper substrateso as to cover the through-hole. The thermoplastic sheetis pressed by a heated pinagainst the cantileverand deformed so as to maintain the connection between the cantileverand the second wiring layer, and therefore close the switch