The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2011
Filed:
Mar. 04, 2009
Da-jiang Yang, Singapore, SG;
Chih-ping Lee, Singapore, SG;
Rui-huang Cheng, Singapore, SG;
Xing-hua Zhang, Singapore, SG;
Xu MA, Singapore, SG;
Xiao-fei Han, Singapore, SG;
Hong MA, Singapore, SG;
Hong Liao, Singapore, SG;
Yuan-li Ding, Singapore, SG;
Da-Jiang Yang, Singapore, SG;
Chih-Ping Lee, Singapore, SG;
Rui-Huang Cheng, Singapore, SG;
Xing-Hua Zhang, Singapore, SG;
Xu Ma, Singapore, SG;
Xiao-Fei Han, Singapore, SG;
Hong Ma, Singapore, SG;
Hong Liao, Singapore, SG;
Yuan-Li Ding, Singapore, SG;
United Microelectronics Corp., Hsinchu, TW;
Abstract
A test pattern structure including a first conductive layer and a second conductive layer is provided. The second conductive layer is directly disposed on the first conductive layer and connected to the first conductive layer through a plurality of connection interfaces. The test pattern structure of the present invention can detect the interconnection failure quickly and correctly without SEM identification.