The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2011
Filed:
Apr. 22, 2008
Timothy H. Daubenspeck, Colchester, VT (US);
Jeffrey P. Gambino, Westford, VT (US);
Jerome B. Lasky, Essex Junction, VT (US);
Christopher D. Muzzy, Burlington, VT (US);
Wolfgang Sauter, Richmond, VT (US);
Timothy H. Daubenspeck, Colchester, VT (US);
Jeffrey P. Gambino, Westford, VT (US);
Jerome B. Lasky, Essex Junction, VT (US);
Christopher D. Muzzy, Burlington, VT (US);
Wolfgang Sauter, Richmond, VT (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method of preventing the formation of cracks on the backside of a silicon (Si) semiconductor chip or wafer during the processing thereof. Also provided is a method for inhibiting the propagation of cracks, which have already formed in the backside of a silicon chip during the processing thereof and prior to the joining thereto of a substrate during the fabrication of an electronic package. The methods entail either treating the backside with a wet etch, or alternatively, applying a protective film layer thereon prior to forming an electronic package incorporating the chip or wafer.