The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2011
Filed:
Apr. 24, 2006
Paul Lukas Brillhart, Pleasanton, CA (US);
Richard Fovell, San Jose, CA (US);
Douglas A. Buchberger, Jr., Livermore, CA (US);
Douglas H. Burns, Saratoaga, CA (US);
Kallol Bera, San Jose, CA (US);
Daniel J. Hoffman, Saratoga, CA (US);
Kenneth W. Cowans, Fullerton, CA (US);
William W. Cowans, Fullerton, CA (US);
Glenn W. Zubillaga, Canyon Lake, CA (US);
Isaac Millan, Anaheim, CA (US);
Paul Lukas Brillhart, Pleasanton, CA (US);
Richard Fovell, San Jose, CA (US);
Douglas A. Buchberger, Jr., Livermore, CA (US);
Douglas H. Burns, Saratoaga, CA (US);
Kallol Bera, San Jose, CA (US);
Daniel J. Hoffman, Saratoga, CA (US);
Kenneth W. Cowans, Fullerton, CA (US);
William W. Cowans, Fullerton, CA (US);
Glenn W. Zubillaga, Canyon Lake, CA (US);
Isaac Millan, Anaheim, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Advanced Thermal Sciences Corporation, Anaheim, CA (US);
Abstract
In a plasma reactor having an electrostatic chuck with an electrostatic chuck top surface for supporting a workpiece, thermal transfer medium flow channels in the interior of the electrostatic chuck, a method for controlling temperature of the workpiece during plasma processing includes circulating thermal transfer medium through the thermal transfer medium flow passages and supplying a thermally conductive gas between the workpiece and the electrostatic chuck top surface, and changing thermal transfer medium thermal conditions of thermal transfer medium flowing in the thermal transfer medium flow channels so as to change the temperature of the electrostatic chuck at a first rate limited by the thermal mass of the electrostatic chuck. The method further includes changing the backside gas pressure of the thermally conductive gas so as to change the temperature of the workpiece at a second rate faster than the first rate.