The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 2011
Filed:
Jun. 02, 2010
Applicants:
Chih-hua Chen, Jhubei, TW;
Chen-shien Chen, Zhubei, TW;
Chen-cheng Kuo, Chu-Pei, TW;
Wen-wei Shen, Xinzhuang, TW;
Inventors:
Chih-Hua Chen, Jhubei, TW;
Chen-Shien Chen, Zhubei, TW;
Chen-Cheng Kuo, Chu-Pei, TW;
Wen-Wei Shen, Xinzhuang, TW;
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
A through silicon via structure includes a top pad and a vertical conductive post that is connected to the top pad. The top pad covers a wider area than the cross section of the vertical conductive post. An interconnect pad is formed at least partially below the top pad. An under layer is also formed at least partially below the top pad. At least one dummy structure connects the top pad and the under layer to fasten the top pad and the interconnect pad.