The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 14, 2011
Filed:
Aug. 27, 2010
Etsurou Morita, Tokyo, JP;
Akihiko Endo, Tokyo, JP;
Yoshihisa Nonogaki, Tokyo, JP;
Hideki Nishihata, Tokyo, JP;
Etsurou Morita, Tokyo, JP;
Akihiko Endo, Tokyo, JP;
Yoshihisa Nonogaki, Tokyo, JP;
Hideki Nishihata, Tokyo, JP;
Sumco Corporation, Tokyo, JP;
Abstract
The thickness of a semiconductor wafer layer, extending from a mirror-finished surface thereof to a solid-state image sensing device, is measured. Based on the residual thickness data, plasma etching is performed from the mirror-finished surface until a predetermined thickness is reached by controlling the plasma etching amount. By doing this, it is possible to reduce variation in the thickness of the solid-state image sensing device at low cost without causing an increase in the number of processes.