The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 2011
Filed:
Aug. 22, 2008
Ichiro Ishimaru, Mure, JP;
Minori Noguchi, Mitsukaidou, JP;
Ichiro Moriyama, Hamura, JP;
Yoshikazu Tanabe, Irima, JP;
Yasuo Yatsugake, Kamisato, JP;
Yukio Kenbou, Tokyo, JP;
Kenji Watanabe, Oume, JP;
Hirofumi Tsuchiyama, Hitachinaka, JP;
Ichiro Ishimaru, Mure, JP;
Minori Noguchi, Mitsukaidou, JP;
Ichiro Moriyama, Hamura, JP;
Yoshikazu Tanabe, Irima, JP;
Yasuo Yatsugake, Kamisato, JP;
Yukio Kenbou, Tokyo, JP;
Kenji Watanabe, Oume, JP;
Hirofumi Tsuchiyama, Hitachinaka, JP;
Hitachi, Ltd., Tokyo, JP;
Hitachi High-Technologies Corporation, Tokyo, JP;
Abstract
The invention provides a surface inspection apparatus and a method for inspecting the surface of a sample that are capable of inspecting discriminatingly between the scratch of various configuration and the adhered foreign object that occur on the surface of a work target when the work target (for example, an insulating film on a semiconductor substrate) is subjected to polishing process such as CMP or grinding process in semiconductor manufacturing process or magnetic head manufacturing process.