The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 05, 2011
Filed:
May. 27, 2005
Kyle K. Kirby, Boise, ID (US);
Salman Akram, Boise, ID (US);
Daniel P. Cram, Boise, ID (US);
Roy T. Lange, Boise, ID (US);
Warren M. Farnworth, Nampa, ID (US);
Kyle K. Kirby, Boise, ID (US);
Salman Akram, Boise, ID (US);
Daniel P. Cram, Boise, ID (US);
Roy T. Lange, Boise, ID (US);
Warren M. Farnworth, Nampa, ID (US);
Micron Technology, Inc., Boise, ID (US);
Abstract
Methods and devices for placing a semiconductor wafer or other substrate in contact with solder are described. A wave soldering apparatus includes a solder bath, a nozzle for producing a solder wave, and a jig for orienting a substrate in a substantially vertical orientation and placing the substrate in contact with a cascading solder wave. In another wave soldering apparatus, a jig orients a semiconductor wafer in a substantially horizontal orientation in contact with the solder wave. Another soldering apparatus includes a tank comprising molten solder and a fixture configured to orient one or more semiconductor wafers in a substantially vertical orientation. Methods of placing semiconductor wafers or other substrates in contact with solder using the devices of the present invention are also disclosed.