The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 01, 2011
Filed:
Feb. 16, 2008
Peter James Lindgren, Essex Junction, VT (US);
Edmund Juris Sprogis, Underhill, VT (US);
Anthony Kendall Stamper, Williston, VT (US);
Kenneth Jay Stein, Sandy Hook, CT (US);
Peter James Lindgren, Essex Junction, VT (US);
Edmund Juris Sprogis, Underhill, VT (US);
Anthony Kendall Stamper, Williston, VT (US);
Kenneth Jay Stein, Sandy Hook, CT (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A through substrate via includes an annular conductor layer at a periphery of a through substrate aperture, and a plug layer surrounded by the annular conductor layer. A method for fabricating the through substrate via includes forming a blind aperture within a substrate and successively forming and subsequently planarizing within the blind aperture a conformal conductor layer that does not fill the aperture and plug layer that does fill the aperture. The backside of the substrate may then be planarized to expose at least the planarized conformal conductor layer.