The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 01, 2011
Filed:
Sep. 03, 2002
Applicants:
Heung L. Park, Wilsonville, OR (US);
Eric G. Webb, Salem, OR (US);
Jonathan D. Reid, Sherwood, CA (US);
Timothy Patrick Cleary, Portland, OR (US);
Inventors:
Heung L. Park, Wilsonville, OR (US);
Eric G. Webb, Salem, OR (US);
Jonathan D. Reid, Sherwood, CA (US);
Timothy Patrick Cleary, Portland, OR (US);
Assignee:
Novellus Systems, Inc., San Jose, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
C23C 18/31 (2006.01); C23C 18/34 (2006.01); C23C 18/36 (2006.01); C23C 18/40 (2006.01); H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract
Electroless plating is performed to deposit conductive materials on work pieces such as partially fabricated integrated circuits. Components of an electroless plating bath are separately applied to a work piece by spin coating to produce a very thin conductive layer (in the range of a few hundred angstroms). The components are typically a reducing agent and a metal source.