The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 11, 2011
Filed:
Jul. 20, 2005
Kiyoshi Murakami, Kyoto, JP;
Masato Ishiba, Kyoto, JP;
Jun Kuriyama, Fukuchiyama, JP;
Teruhisa Yotsuya, Kyoto, JP;
Kiyoshi Murakami, Kyoto, JP;
Masato Ishiba, Kyoto, JP;
Jun Kuriyama, Fukuchiyama, JP;
Teruhisa Yotsuya, Kyoto, JP;
OMRON Corporation, Kyoto, JP;
Abstract
Inspection apparatus are used to inspect a substrate as solder is printed, components are mounted and the substrate is heated for a soldering process. Images of the substrate are taken both before and after a production process such as the component mounting process and the soldering process and their differences are extracted. Each component on the substrate may be identified by differentiation and binarization processes and setting conditions for windows are determined corresponding to identified components. Windows are set according to determined setting conditions for inspecting the conditions of the substrate by using image data in the set windows and standard inspection data corresponding to component identification data.