The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 04, 2011

Filed:

May. 27, 2009
Applicants:

Antonio B. Dimaano, Jr., Singapore, SG;

IL Kwon Shim, Singapore, SG;

Sheila Rima C. Magno, Singapore, SG;

Inventors:

Antonio B. Dimaano, Jr., Singapore, SG;

Il Kwon Shim, Singapore, SG;

Sheila Rima C. Magno, Singapore, SG;

Assignee:

Stats Chippac Ltd., Singapore, SG;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/495 (2006.01); H01R 43/16 (2006.01); H05K 5/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of manufacture of an integrated circuit packaging system is provided including: forming a D-ring includes half etching a paddle, etching a ring, and etching a tie bar. The tie bar is between the paddle and the ring. The system further includes mounting an integrated circuit die on a central portion of the D-ring, connecting the integrated circuit die and the D-ring, and encapsulating the integrated circuit die and a portion of the D-ring.


Find Patent Forward Citations

Dimaano, Jr., Antonio. (2011). Integrated circuit packaging system with etched ring and die paddle and method of manufacture thereof (U.S. Patent No. 7863108). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7863108

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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