The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 04, 2011
Filed:
May. 08, 2008
Applicants:
Takehiko Orii, Nirasaki, JP;
Tatsuya Nishida, Tosu, JP;
Osamu Kuroda, Tosu, JP;
Inventors:
Assignee:
Tokyo Electron Limited, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/027 (2006.01); H01L 21/304 (2006.01); B08B 3/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
A substrate processing apparatus is provided. The apparatus includes a plurality of fluid suppliersfor supplying different processing fluids. In processing a wafer W, the substrate processing apparatus moves the fluid suppliersalong the peripheral part of the wafer W relatively. The fluid suppliersare arranged in a direction extending from the circumference of the wafer W to its inside. With the arrangement, the apparatus is capable of stable processing of the wafer W in spite of rotating the wafer W at a low speed. Further, it is possible to improve a throughput of the apparatus in resist processing.