The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 14, 2010

Filed:

Apr. 09, 2003
Applicants:

Satoshi Wakabayashi, Tokyo, JP;

Tetsuji Togawa, Tokyo, JP;

Ryuichi Kosuge, Tokyo, JP;

Koji Ato, Tokyo, JP;

Hiroshi Sotozaki, Tokyo, JP;

Inventors:

Satoshi Wakabayashi, Tokyo, JP;

Tetsuji Togawa, Tokyo, JP;

Ryuichi Kosuge, Tokyo, JP;

Koji Ato, Tokyo, JP;

Hiroshi Sotozaki, Tokyo, JP;

Assignee:

Ebara Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23F 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A polishing apparatus has a plurality of polishing units. Moving mechanisms for moving top rings between polishing positions on polishing surfaces and wafer receiving/delivering positions are provided in each of the polishing units. Linear transporters are provided for transferring a wafer between a plurality of transferring positions including the wafer receiving/delivering positions. Pushers for receiving and delivering the wafer between the linear transporters and the top rings are provided at the transferring positions as the wafer receiving/delivering positions.


Find Patent Forward Citations

Loading…