The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 30, 2010

Filed:

May. 15, 2009
Applicants:

Woo-jin Lee, Tama, JP;

Atsuki Fukazawa, Tama, JP;

Inventors:

Woo-Jin Lee, Tama, JP;

Atsuki Fukazawa, Tama, JP;

Assignee:

ASM Japan K.K., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/312 (2006.01); C23C 16/26 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of forming a conformal amorphous hydrogenated carbon layer on an irregular surface of a semiconductor substrate includes: vaporizing a hydrocarbon-containing precursor; introducing the vaporized precursor and an argon gas into a CVD reaction chamber inside which the semiconductor substrate is placed; depositing a conformal amorphous hydrogenated carbon layer on the irregular surface of the semiconductor substrate by plasma CVD; and controlling the deposition of the conformal ratio of the depositing conformal amorphous hydrogenated carbon layer. The controlling includes (a) adjusting a step coverage of the conformal amorphous hydrogenated carbon layer to about 30% or higher as a function of substrate temperature, and (b) adjusting a conformal ratio of the conformal amorphous hydrogenated carbon layer to about 0.9 to about 1.1 as a function of RF power and/or argon gas flow rate.

Published as:

Find Patent Forward Citations

Lee, Woo-Jin. (2010). Method of forming highly conformal amorphous carbon layer (U.S. Patent No. 7842622). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7842622

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