The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 02, 2010
Filed:
Dec. 06, 2007
Daniel C. Wack, Los Altos, CA (US);
Andrei Veldman, Issaquah, WA (US);
Edward R. Ratner, Los Altos, CA (US);
John Hench, Los Gatos, CA (US);
Noah Bareket, Saratoga, CA (US);
Daniel C. Wack, Los Altos, CA (US);
Andrei Veldman, Issaquah, WA (US);
Edward R. Ratner, Los Altos, CA (US);
John Hench, Los Gatos, CA (US);
Noah Bareket, Saratoga, CA (US);
KLA-Tencor Technologies Corporation, Milpitas, CA (US);
Abstract
The present application discloses a method of model-based measurement of semiconductor device features using a scatterometer system. The method includes at least the following steps. A cost function is defined depending upon a plurality of variable parameters of the scatterometer system and upon a plurality of variable parameters for computer-implemented modeling to determine measurement results. Constraints are established for the plurality of variable parameters of the scatterometer system and for the plurality of variable parameters for the computer-implemented modeling. A computer-implemented optimization procedure is performed to determine an optimized global set of parameters, including both the variable parameters of the scatterometer system and the variable parameters for the computer-implemented modeling, which result in a minimal value of the cost function. Finally, the optimized global set of parameters is applied to configure the scatterometer system and the computer-implemented modeling. Other embodiments, features and aspects are also disclosed herein.