The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 02, 2010

Filed:

Mar. 22, 2007
Applicants:

Tien-chen HU, Pingtung, TW;

Chih-ming Hsieh, Tainan, TW;

Chien-chang Lai, Nantou, TW;

Wen-jin Lee, Tainan, TW;

Da-hsiang Chen, Tainan, TW;

Inventors:

Tien-Chen Hu, Pingtung, TW;

Chih-Ming Hsieh, Tainan, TW;

Chien-Chang Lai, Nantou, TW;

Wen-Jin Lee, Tainan, TW;

Da-Hsiang Chen, Tainan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B08B 11/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A system for cleaning a wafer. At least one first chuck roller is connected to a first roller base and includes a first annular groove. A second roller base opposes the first roller base. At least one second chuck roller is connected to the second roller base and includes a second annular groove. A sensing chuck roller is connected to the second roller base and includes a third annular groove corresponding to the first and second annular grooves. A cleaning member covers the third annular groove. A circumferential edge of the wafer is positioned in the first and second annular grooves and abuts the cleaning member. The first and second chuck rollers rotate the wafer, enabling the circumferential edge thereof to rub against the cleaning member.


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