The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 26, 2010
Filed:
Aug. 04, 2009
William F. Burghout, Mesa, AZ (US);
Francis J. Carney, Queen Creek, AZ (US);
Joseph K. Fauty, Mesa, AZ (US);
James P. Letterman, Mesa, AZ (US);
Jay A. Yoder, Phoenix, AZ (US);
William F. Burghout, Mesa, AZ (US);
Francis J. Carney, Queen Creek, AZ (US);
Joseph K. Fauty, Mesa, AZ (US);
James P. Letterman, Mesa, AZ (US);
Jay A. Yoder, Phoenix, AZ (US);
Semiconductor Components Industries, LLC, Phoenix, AZ (US);
Abstract
In one embodiment, a method for forming a leaded molded array package includes placing a lead frame assembly into a molding apparatus having lead cavities. The method further includes forming seals between conductive leads within the lead frame assembly and the lead cavities, and encapsulating the lead frame assembly to form a molded array assembly. The molded array assembly is then separated into individual leaded molded packages.