The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 19, 2010
Filed:
Sep. 25, 2008
Ling-chun Chou, Yunlin County, TW;
Ming-tsung Chen, Hsin-Chu Hsien, TW;
Hsi-hua Liu, Taipei, TW;
Shuen-cheng Lei, Tainan County, TW;
Po-chao Tsao, Taipei Hsien, TW;
Ling-Chun Chou, Yunlin County, TW;
Ming-Tsung Chen, Hsin-Chu Hsien, TW;
Hsi-Hua Liu, Taipei, TW;
Shuen-Cheng Lei, Tainan County, TW;
Po-Chao Tsao, Taipei Hsien, TW;
United Microelectronics Corp., Science-Based Industrial Park, Hsin-Chu, TW;
Abstract
A defect inspection method is disclosed. A first type defect inspection system is used to perform a first defect inspection by aligning to an alignment mark on a wafer as a reference point for the first defect inspection. A fabrication process is performed on the wafer thereafter, and a second defect inspection is performed by using a second type defect inspection system to align the alignment mark on the wafer as the reference point for the second defect inspection.