The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 28, 2010
Filed:
Feb. 09, 2007
Francesco DE Rege Thesauro, Naperville, IL (US);
Steven Grumbine, Aurora, IL (US);
Phillip Carter, Lake Bluff, IL (US);
Shoutian LI, Naperville, IL (US);
Jian Zhang, Pleasanton, CA (US);
David Schroeder, Aurora, IL (US);
Ming-shih Tsai, Hsinchu, TW;
Francesco De Rege Thesauro, Naperville, IL (US);
Steven Grumbine, Aurora, IL (US);
Phillip Carter, Lake Bluff, IL (US);
Shoutian Li, Naperville, IL (US);
Jian Zhang, Pleasanton, CA (US);
David Schroeder, Aurora, IL (US);
Ming-Shih Tsai, Hsinchu, TW;
Cabot Microelectronics Corporation, Aurora, IL (US);
Abstract
The invention provides a composition for chemical-mechanical polishing. The composition comprises an abrasive, a first metal rate polishing modifier agent, a second metal rate polishing modifier agent, and a liquid carrier. In one embodiment, the first metal rate polishing modifier agent has a standard reduction potential less than 0.34 V relative to a standard hydrogen electrode, and the second metal rate polishing modifier agent has a standard reduction potential greater than 0.34 V relative to a standard hydrogen electrode. In other embodiments, the first and second metal rate polishing modifier agents are different oxidizing agents.