The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 14, 2010
Filed:
Jul. 18, 2008
Kris Bhaskar, San Jose, CA (US);
Mark Mccord, Mountain View, CA (US);
Santosh Bhattacharyya, San Jose, CA (US);
Ardis Liang, Fremont, CA (US);
Richard Wallingford, San Jose, CA (US);
Hubert Altendorfer, Redwood Shores, CA (US);
Kais Maayah, San Jose, CA (US);
Kris Bhaskar, San Jose, CA (US);
Mark McCord, Mountain View, CA (US);
Santosh Bhattacharyya, San Jose, CA (US);
Ardis Liang, Fremont, CA (US);
Richard Wallingford, San Jose, CA (US);
Hubert Altendorfer, Redwood Shores, CA (US);
Kais Maayah, San Jose, CA (US);
KLA-Tencor Corp., San Jose, CA (US);
Abstract
Methods for generating a standard reference die for use in a die to standard reference die inspection and methods for inspecting a wafer are provided. One computer-implemented method for generating a standard reference die for use in a die to standard reference die inspection includes acquiring output of an inspection system for a centrally located die on a wafer and one or more dies located on the wafer. The method also includes combining the output for the centrally located die and the one or more dies based on within die positions of the output. In addition, the method includes generating the standard reference die based on results of the combining step.