The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 14, 2010

Filed:

Dec. 28, 2006
Applicants:

Shu-luan Chan, Zhongli, TW;

Chi-chih Huang, Taipei, TW;

Shuo-hsun Chang, Zhongli, TW;

Inventors:

Shu-Luan Chan, Zhongli, TW;

Chi-Chih Huang, Taipei, TW;

Shuo-Hsun Chang, Zhongli, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/053 (2006.01);
U.S. Cl.
CPC ...
Abstract

A substrate structure is disclosed. The substrate structure includes a core substrate, an interconnection portion and a solder mask. The core substrate includes a top surface and a bottom surface opposite the top surface. A circuit pattern is disposed on the top surface. The interconnection portion is disposed on the top surface; herein the interconnection portion includes a surface dielectric layer and a surface circuit layer disposed on the surface dielectric layer. The surface circuit layer is electrically connected to the circuit pattern. The solder mask is disposed on the interconnection portion; herein the solder mask includes a hole to identify the substrate structure. Besides, a method for manufacturing the substrate structure is disclosed.


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