The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 31, 2010
Filed:
Feb. 27, 2008
Kuan-neng Chen, White Plains, NY (US);
Bruce K. Furman, Pouquag, NY (US);
Edmund J. Sprogis, Underhill, VT (US);
Anna W. Topol, Jefferson Valley, NY (US);
Cornelia K. Tsang, Mohegan Lake, NY (US);
Matthew R. Wordeman, Kula, HI (US);
Albert M. Young, Fishkill, NY (US);
Kuan-Neng Chen, White Plains, NY (US);
Bruce K. Furman, Pouquag, NY (US);
Edmund J. Sprogis, Underhill, VT (US);
Anna W. Topol, Jefferson Valley, NY (US);
Cornelia K. Tsang, Mohegan Lake, NY (US);
Matthew R. Wordeman, Kula, HI (US);
Albert M. Young, Fishkill, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A sealed microelectronic structure which provides mechanical stress endurance and includes at least two chips being electrically connected to a semiconductor structure at a plurality of locations. Each chip includes a continuous bonding material along it's perimeter and at least one support column connected to each of the chips positioned within the perimeter of each chip. Each support column extends outwardly such that when the at least two chips are positioned over one another the support columns are in mating relation to each other. A seal between the at least two chips results from the overlapping relation of the chip to one another such that the bonding material and support columns are in mating relation to each other. Thus, the seal is formed when the at least two chips are mated together, and results in a bonded chip structure.