The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 31, 2010

Filed:

Sep. 06, 2004
Applicants:

Makoto Kitabatake, Nara, JP;

Osamu Kusumoto, Nara, JP;

Masao Uchida, Osaka, JP;

Kunimasa Takahashi, Osaka, JP;

Kenya Yamashita, Osaka, JP;

Inventors:

Makoto Kitabatake, Nara, JP;

Osamu Kusumoto, Nara, JP;

Masao Uchida, Osaka, JP;

Kunimasa Takahashi, Osaka, JP;

Kenya Yamashita, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/492 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor apparatus includes a semiconductor chipincluding a power semiconductor device using a wide band gap semiconductor, base materialsand, first and second intermediate membersand, a heat conducting member, a radiation fin, and an encapsulating materialfor encapsulating the semiconductor chip, the first and second intermediate memberandand the heat conducting member. The tips of the base materialsandwork respectively as external connection terminalsand. The second intermediate memberis made of a material with lower heat conductivity than the first intermediate member, and a contact area with the semiconductor chipis larger in the second intermediate memberthan in the first intermediate member.


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