The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 17, 2010

Filed:

Sep. 11, 2006
Applicants:

Vivek Chickermane, Ithaca, NY (US);

James Sage, Kirkwood, NY (US);

Patrick Gallagher, Apalachin, NY (US);

Xiaochuan Yuan, Vestal, NY (US);

Inventors:

Vivek Chickermane, Ithaca, NY (US);

James Sage, Kirkwood, NY (US);

Patrick Gallagher, Apalachin, NY (US);

Xiaochuan Yuan, Vestal, NY (US);

Assignee:

Cadence Design Systems, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01);
U.S. Cl.
CPC ...
Abstract

In the field of integrated circuit design and testing, especially directed towards integrated circuits intended to operate at low power, a method and system are provided for circuit design and simulation and testing for mapping portions of a circuit, such as a power domain or portion of a power domain, to a test mode. Thereby only those portions of the circuit which need to be powered up in a particular test mode are powered up both in the design (simulation) phase and in the actual testing. This conserves power usage during actual testing as against powering up all portions of the circuit, which is not desirable during the testing of the circuit after manufacture. This ensures that the power conditions required to excite and observe any circuit faults during testing exist for the power conditions that are applied during, for instance, manufacturing testing. By automatically partitioning the faults to remove those that cannot be excited or observed during manufacturing and testing, the testability of the device in terms of its partitions or parts will accurately reflect the power state of the logic portions of the circuit.


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