The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 17, 2010
Filed:
Jun. 22, 2006
Amir Al-bayati, San Jose, CA (US);
Lester A. D'cruz, San Jose, CA (US);
Alexandros T. Demos, Fremont, CA (US);
Dale R. Dubois, Los Gatos, CA (US);
Khaled A. Elsheref, San Jose, CA (US);
Naoyuki Iwasaki, Narita, JP;
Hichem M'saad, Santa Clara, CA (US);
Juan Carlos Rocha-alvarez, Sunnyvale, CA (US);
Ashish Shah, Santa Clara, CA (US);
Takashi Shimizu, Kawasaki, JP;
Amir Al-Bayati, San Jose, CA (US);
Lester A. D'Cruz, San Jose, CA (US);
Alexandros T. Demos, Fremont, CA (US);
Dale R. Dubois, Los Gatos, CA (US);
Khaled A. Elsheref, San Jose, CA (US);
Naoyuki Iwasaki, Narita, JP;
Hichem M'Saad, Santa Clara, CA (US);
Juan Carlos Rocha-Alvarez, Sunnyvale, CA (US);
Ashish Shah, Santa Clara, CA (US);
Takashi Shimizu, Kawasaki, JP;
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
Methods and apparatus for electron beam treatment of a substrate are provided. An electron beam apparatus that includes a vacuum chamber, at least one thermocouple assembly in communication with the vacuum chamber, a heating device in communication with the vacuum chamber, and combinations thereof are provided. In one embodiment, the vacuum chamber comprises an electron source wherein the electron source comprises a cathode connected to a high voltage source, an anode connected to a low voltage source, and a substrate support. In another embodiment, the vacuum chamber comprises a grid located between the anode and the substrate support. In one embodiment the heating device comprises a first parallel light array and a second light array positioned such that the first parallel light array and the second light array intersect. In one embodiment the thermocouple assembly comprises a temperature sensor made of aluminum nitride.