The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 27, 2010
Filed:
Jun. 28, 2007
Chien-ko Liao, Taichung, TW;
Chin-tien Chiu, Taichung, TW;
Jack Chang Chien, Kaoshiung, TW;
Cheemen Yu, Madison, WI (US);
Hem Takiar, Fremont, CA (US);
Chien-Ko Liao, Taichung, TW;
Chin-Tien Chiu, Taichung, TW;
Jack Chang Chien, Kaoshiung, TW;
Cheemen Yu, Madison, WI (US);
Hem Takiar, Fremont, CA (US);
SanDisk Corporation, Milpitas, CA (US);
Abstract
A semiconductor device having a redistribution layer, and methods of forming same, are disclosed. After fabrication of semiconductor die on a wafer, a tape assembly is applied onto a surface of the wafer, in contact with the surfaces of each semiconductor die on the wafer. The tape assembly includes a backgrind tape as a base layer, and a film assembly adhered to the backgrind tape. The film assembly in turn includes an adhesive film on which is deposited a thin layer of conductive material. The redistribution layer pattern is traced into the tape assembly, using for example a laser. Thereafter, the unheated portions of the tape assembly may be removed, leaving the heated redistribution layer pattern on each semiconductor die.