The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 20, 2010
Filed:
Aug. 22, 2007
Roger A. Booth, Jr., Wappingers Falls, NY (US);
Maryjane Brodsky, Salt Point, NY (US);
Kangguo Cheng, Beacon, NY (US);
Chengwen Pei, Danbury, CT (US);
Roger A. Booth, Jr., Wappingers Falls, NY (US);
MaryJane Brodsky, Salt Point, NY (US);
Kangguo Cheng, Beacon, NY (US);
Chengwen Pei, Danbury, CT (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A thin semiconductor layer is formed and patterned on a semiconductor substrate to form a thin semiconductor fuselink on shallow trench isolation and between an anode semiconductor region and a cathode semiconductor region. During metallization, the semiconductor fuselink is converted to a thin metal semiconductor alloy fuselink as all of the semiconductor material in the semiconductor fuselink reacts with a metal to form a metal semiconductor alloy. The inventive electrical fuse comprises the thin metal semiconductor alloy fuselink, a metal semiconductor alloy anode, and a metal semiconductor alloy cathode. The thin metal semiconductor alloy fuselink has a smaller cross-sectional area compared with prior art electrical fuses. Current density within the fuselink and the divergence of current at the interface between the fuselink and the cathode or anode comparable to prior art electrical fuses are obtained with less programming current than prior art electrical fuses.