The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 20, 2010
Filed:
Apr. 18, 2008
Werner Kroeninger, Regensburg, DE;
Josef Schwaiger, Teugn, DE;
Ludwig Schneider, Parkstetten, DE;
Ottmar Geitner, Pentling, DE;
Markus Brunnbauer, Lappersdorf, DE;
Thorsten Meyer, Regensburg, DE;
Ralf Otremba, Kaufbeuren, DE;
Josef Hoeglauer, Munich, DE;
Helmut Strack, Munich, DE;
Xaver Schloegel, Sachsenkamm, DE;
Werner Kroeninger, Regensburg, DE;
Josef Schwaiger, Teugn, DE;
Ludwig Schneider, Parkstetten, DE;
Ottmar Geitner, Pentling, DE;
Markus Brunnbauer, Lappersdorf, DE;
Thorsten Meyer, Regensburg, DE;
Ralf Otremba, Kaufbeuren, DE;
Josef Hoeglauer, Munich, DE;
Helmut Strack, Munich, DE;
Xaver Schloegel, Sachsenkamm, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A semiconductor module. One embodiment provides at least two semiconductor chips placed on a carrier. The at least two semiconductor chips are then covered with a molding material to form a molded body. The molded body is thinned until the at least two semiconductor chips are exposed. Then, the carrier is removed from the at least two semiconductor chips. The at least two semiconductor chips are singulated.