The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 08, 2010
Filed:
Feb. 02, 2007
Tsung-tien Hsieh, Taichung, TW;
Wen-jung Chiang, Taichung Hsien, TW;
Yu-po Wang, Taichung Hsien, TW;
Cheng-hsu Hsiao, Taichung Hsien, TW;
Sen-yen Yang, Taichung, TW;
Tsung-Tien Hsieh, Taichung, TW;
Wen-Jung Chiang, Taichung Hsien, TW;
Yu-Po Wang, Taichung Hsien, TW;
Cheng-Hsu Hsiao, Taichung Hsien, TW;
Sen-Yen Yang, Taichung, TW;
Abstract
A semiconductor package substrate is provided, which includes a substrate body having a plurality of conductive through holes formed therein, wherein at least two adjacent conductive through holes are formed as a differential pair, each of which has a ball pad formed at an end thereof; and at least one electrically integrated layer formed in the substrate body, and having an opening corresponding to the two adjacent conductive through holes formed as the differential pair and the ball pads thereof. Thus, the spacing between the conductive through holes and the electrically integrated layer and the spacing between the ball pads can be enlarged by the opening, so as to balance the impedance match.