The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 01, 2010
Filed:
Dec. 07, 2004
Kenong Wu, Davis, CA (US);
David Randall, Sunnyvale, CA (US);
Kourosh Nafisi, Los Altos, CA (US);
Ramon Ynzunza, Milpitas, CA (US);
Ingrid B. Peterson, Menlo Park, CA (US);
Ariel Tribble, Fremont, CA (US);
Michal Kowalski, Santa Cruz, CA (US);
Lisheng Gao, Morgan Hill, CA (US);
Ashok Kulkarni, San Jose, CA (US);
Kenong Wu, Davis, CA (US);
David Randall, Sunnyvale, CA (US);
Kourosh Nafisi, Los Altos, CA (US);
Ramon Ynzunza, Milpitas, CA (US);
Ingrid B. Peterson, Menlo Park, CA (US);
Ariel Tribble, Fremont, CA (US);
Michal Kowalski, Santa Cruz, CA (US);
Lisheng Gao, Morgan Hill, CA (US);
Ashok Kulkarni, San Jose, CA (US);
KLA-Tencor Technologies Corp., Milpitas, CA (US);
Abstract
Various computer-implemented methods are provided. One method for sorting defects in a design pattern of a reticle includes searching for defects of interest in inspection data using priority information associated with individual defects in combination with one or more characteristics of a region proximate the individual defects. The priority information corresponds to modulation levels associated with the individual defects. The inspection data is generated by comparing images of the reticle generated for different values of a lithographic variable. The images include at least one reference image and at least one modulated image. A composite reference image can be generated from two or more reference images. The method also includes assigning one or more identifiers to the defects of interest. The identifier(s) may include, for example, a defect classification and/or an indicator identifying if the defects of interest are to be used for further processing.