The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 01, 2010
Filed:
Aug. 10, 2004
Jeffrey O'dell, Deephaven, MN (US);
Thomas Verburgt, Eden Prairie, MN (US);
Mark Harless, New Hope, MN (US);
Cory Watkins, Ramsey, MN (US);
Jeffrey O'Dell, Deephaven, MN (US);
Thomas Verburgt, Eden Prairie, MN (US);
Mark Harless, New Hope, MN (US);
Cory Watkins, Ramsey, MN (US);
Rudolph Technologies, Inc., Flanders, NJ (US);
Abstract
An automated defect inspection system has been invented and is used on patterned wafers, whole wafers, broken wafers, partial wafers, sawn wafers such as on film frames, JEDEC trays, Auer boats, die in gel or waffle packs, MCMs, etc. and is specifically intended and designed for second optical wafer inspection for such defects as metalization defects (such as scratches, voids, corrosion, and bridging), diffusion defects, passivation layer defects, scribing defects, glassivation defects, chips and cracks from sawing, solder bump defects, and bond pad area defects.