The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 01, 2010
Filed:
Sep. 29, 2004
Chad A. Kumaus, Chandler, AZ (US);
Carl Deppisch, Chandler, AZ (US);
Daewoong Suh, Phoenix, AZ (US);
Ashay A. Dani, Chandler, AZ (US);
Chad A. Kumaus, Chandler, AZ (US);
Carl Deppisch, Chandler, AZ (US);
Daewoong Suh, Phoenix, AZ (US);
Ashay A. Dani, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
A method for forming a high thermal conductivity heat sink to IC package interface is disclosed. The method uses reactive getter materials added to a two phase solder system having a phase change temperature that is about the normal operating temperature range of the IC, to bind absorbed and dissolved oxygen in the two phase solder interface material at or near the air to solder surface. Over time this chemical binding action results in an oxide layer at the air to solder surface that slows the rate of oxygen absorption into the solder interface material, and thus reduces the harmful oxidation of the solder to IC package interface and the solder to heat sink interface.